TM 1-1520-253-23
4.11.3.1
NDI Equipment and Materials. (Refer to Appendix B.)
a.
Bond Test Unit
b.
Probe, Mechanical Impedance Analysis
c.
Probe Holder
d.
Cable Assembly
e.
Test Block, Composite Defect Standard #1
f.
Teflon Tape, refer to Table 1-8
g.
Aircraft Marking Pencil, refer to Table 1-8
4.11.3.2
Preparation of Helicopter. The helicopter shall be prepared for safe ground maintenance. If required, the
cargo ramp shall be removed in accordance with applicable technical manuals listed in Table 1-1.
4.11.3.3
Access. Not applicable.
4.11.3.4
Preparation of Part. The components shall be thoroughly cleaned. Refer to Preparation of Part or Area for
NDI, paragraph 1.4.4.
4.11.3.5
NDI Equipment Settings. Refer to Bond Test Equipment, paragraph 1.4.6.1.
a.
Attach cable and probe to Bondmaster. Protect probe with Teflon tape and install in probe
holder.
b.
Turn on Bondmaster, press SPCL, and make the following adjustments:
H Pos
- 40%
V Pos
- 80%
PHASE REF
-0
DRIVE
- MID
c.
Press SET and select DISPLAY - PHASE.
d.
Place probe on the good area of test block and press GOOD PART. Do this several times while moving
the probe to different spots in the good area of the test block. Note the video signature for each. Select
and enter a representative good area by pressing GOOD PART one last time.
e.
Place probe on void area of test block and press BAD PART. Do this several times while moving the
probe slightly to different positions within the void area. Select and enter a position that gives a strong
difference between good and void areas. (See Figure 1-5.) Use DIFF soft key to observe difference
between good and bad areas of test block.
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