TM 1-1520-264-23
4.3.3
Primary Method. Bond Testing.
4.3.3.1 NDI Equipment and Materials. (Refer to Appendix B.)
a.
Bond Test Unit
b.
Probe Mechanical Impedance Analysis
c.
Probe Holder
d.
Cable Assembly
e.
Test Block, metal honeycomb with skin thickness closest to that of the panel to be inspected (refer to Appendix
C)
f.
Test Block, Composite Defect Standard #1
g.
Test Block, Composite Defect Standard #3
h.
Teflon Tape, consumable material, refer to Table 1-8
i.
Aircraft Marking Pencil, refer to Table 1-8
4.3.3.2 Preparation of Helicopter. The helicopter shall be prepared for safe ground maintenance in accordance with
applicable technical manuals listed in Table 1-1.
4.3.3.3 Access. Not applicable.
4.3.3.4 Preparation of Part. The components shall be thoroughly cleaned
. Refer to Preparation of Part or Area for NDI,
paragraph 1.4.4.
4.3.3.5 NDI Equipment Settings. Refer to Bond Testing Equipment, paragraph 1.4.6.1.
a.
Attach cable and probe to Bondmaster. Protect probe with Teflon tape and install in probe holder.
b.
Turn on Bondmaster, press SPCL, and make the following adjustments.
H Pos
-40%
VPos
- 80%
PHASE REF
- 0
DRIVE
- MID
c.
Press SET and select DISPLAY - PHASE.
d.
Place probe on good area of test block and press GOOD PART. Do this several times while m
oving the probe to
different spots in the good area of the test block. Note the video signature for each. Select and enter a
representative good area by pressing GOOD PART one last time.
e.
Place probe on void area of the test block and press BAD PART. Do this several times while moving the probe
slightly to different positions within the void area. Select and enter a position that gives a strong difference
between good and void areas. Use DIFF soft key to observe difference between good and bad areas of test
block.
4-8
