This setup is very sensitive to thin skin-to-core bonding. If the panel skin is 0.020 inch thick or
less, move the probe slowly over the skin and note the slight amplitude change (bounce) as the
probe senses alternately the honeycomb cell nodes and cell walls. Be sure of panel
configuration. Panel edges and attachment points may not be bonded structure and do not
normally contain honeycomb. These areas will respond similarly to voids with the Bondmaster.
Panels having rigidized skins are more easily scanned using wide Teflon tape on the probe
Marking and Recording of Inspection Results. Mark and record as required by paragraph 1.3.
Attention shall be directed to accurately mark the boundaries of all voids. These markings will
be needed to determine acceptance or rejection criteria in accordance with applicable technical
Backup Method. None required.
4.2.5 System Securing. If removed, install any components and secure all access panels as required in accordance
with the applicable technical manuals listed in Table 1-1.