TM 1-1520-253-23
NOTE
If, during setup, the flying spot deflects upward or to the side when the probe passes over the
bad part, instead of the desired down deflection toward the alarm box, press SPCL and toggle to
a different phase setting (90, 180, or 270), and repeat steps d. and e. Continue to try phase
setting until the flying spot moves in the desired down direction.
f.
Place probe on good area of test block and press RUN. Flying spot should be near the top-center of the
ACTIVE screen. If not, press NULL. Slide probe from good to void area and note response from flying spot.
This response should provide both amplitude (vertical) and phase (horizontal) movement. The default
gate/alarm setting may be incorrect for this setup. Turn off or reset gate/alarm as desired.
g. The Bondmaster is programmed to automatically set test parameters to a start-up or initial bond test. By
following the steps outlined above, adjustments to the FREQ, GAIN, and ALARM can help to refine the
selectivity in locating defects among differing composite materials.
2.14.3.6 Inspection Procedure. Refer to Bond Test Method, paragraph 1.4.6 and inspection areas shown in Figure 2-14.
Place probe on cover in location where test for void is desired and press NULL. Move probe from good to suspect area
and note response. A strong amplitude change and phase shift similar to the standard is indicative of a void.
2.14.3.7 Marking and Recording of Inspection Results. Mark and record as required by paragraph 1.3.
NOTE
Attention shall be directed to accurately mark the boundaries of all voids. These markings will
be needed to determine acceptance or rejection criteria in accordance with applicable technical
manuals.
Figure 2-14. Weather Protective Cover
