TM 1-1520-253-23
4.7.3.6
Inspection Procedure. Refer to Bond Test Method, paragraph 1.4.6 and Figure 4-7. Place probe on pod in
location where test for void is desired and press NULL. Move probe from good to suspect area and note response. A
strong amplitude change and phase shift similar to the standard is indicative of a void.
NOTE
This setup is very sensitive to thin skin-to-core bonding. If the panel skin is 0.020 inch thick or
less, move the probe slowly over the skin and note the slight amplitude change (bounce) as the
probe senses alternately the honeycomb cell nodes and cell walls. Be sure of panel
configuration. Panel edges and attachment points may not be bonded structure and do not
normally contain honeycomb. These areas will respond similarly to voids with the Bondmaster.
Panels having rigidized skins are more easily scanned using wide Teflon tape on the probe
holder.
4.7.3.7
Marking and Recording of Inspection Results. Mark and record as required by paragraph 1.3.
NOTE
Attention shall be directed to accurately mark the boundaries of all voids. These markings will
be needed to determine acceptance or rejection criteria in accordance with applicable technical
manuals.
Figure 4-7. Pods
4-18
