TM 1-6625-476-30
4-1
CHAPTER 4
DAY SENSOR SUBASSEMBLY
Section
Page
Preparation for Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
4-1
Description of Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
II
4-3
Test Prompted Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
III
4-5
Test Prompted References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IV
4-19
Section I. PREPARATION FOR TEST
Subject
Para
Page
Test Preparation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-1
4-1
UUT Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-2
4-1
Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-3
4-1
4-1. TEST PREPARATION.
No special procedures are required to prepare the day sensor subassembly for test. Refer to the UUT/
TPS/interface device matrix tables in appendix B to determine the correct UUT test program part number
for the day sensor subassembly. Then refer to the UUT test program for a list of cables, test equipment,
and test accessories required to test the day sensor subassembly.
4-2. UUT DESCRIPTION.
The day sensor subassembly (figure 4-1) is a subassembly of the TADS day sensor subassembly. It is a
casting containing optics and electronic subassemblies, and clamps to the left side of the TADS turret
assembly.
4-3. PRECAUTIONS.
The day sensor subassembly is an electro-mechanical device containing delicate electro-optical
components. Use extreme care when handling the day sensor subassembly to prevent damage to these
components. Observe the following general guidelines when lifting or moving it.
a. Weight. The day sensor subassembly with its subassemblies weighs approximately 35 pounds.
Always get help when lifting or moving it.
b. Optics. Do not touch optics assemblies with your bare hands. Do not use the optics assemblies for
any purpose when lifting the day sensor subassembly. If you accidentally place any pressure or force on
the optics assemblies, you could contaminate them, damage them, or cause misalinement.
c. Sharp Edges. The day sensor subassembly casting contains many sharp edges. Use extreme care
when moving it.
